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solder-melt profile

См. также в других словарях:

  • Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… …   Wikipedia

  • Reflow soldering — is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily hold the components to their attachment pads, after which the assembly is carefully heated in order to solder the joint. The assembly may… …   Wikipedia

  • Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents …   Wikipedia

  • Fuse (electrical) — A miniature time delay fuse used to protect electronic equipment, rated 0.3 amperes at 250 volts. 1.25 inches (about 32 mm) long …   Wikipedia

  • Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads …   Wikipedia

  • Shaped charge — Sectioned high explosive anti tank round with the inner shaped charge visible …   Wikipedia

  • Mary Jane Kelly — The canonical five Jack the Ripper victims Mary Ann Nichols Annie Chapman Elizabeth Stride Catherine Eddowes Mary Jane Kelly Mary Jane Kelly (c. 1863 – 9 November 1888), also known as Marie Jeanette Kelly, Fair Emma , Ginger and Black Mary , is… …   Wikipedia

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